Lens assembly, camera module, and optical device

ABSTRACT

A lens assembly can include: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module. The conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/149,147, filed Jan. 14, 2021; which is a continuation of U.S.application Ser. No. 16/068,286, filed Jul. 5, 2018, now U.S. Pat. No.10,921,545, issued Feb. 16, 2021; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2017/000185,filed Jan. 6, 2017, which claims priority to Korean Application No.10-2016-0001493, filed Jan. 6, 2016, the disclosures of each of whichare incorporated herein by reference in their entirety.

TECHNICAL FIELD

This embodiment relates to a lens assembly, a camera module, and anoptical device.

BACKGROUND ART

This section provides background information related to the presentdisclosure, which is not necessarily prior art.

Concomitant with widely generalized dissemination of various mobileterminals and commercialization of wireless Internet services, demandsby consumers related to mobile terminals are diversified to promptvarious types of circumferential devices or additional equipment to bemounted on mobile terminals.

Inter alia, camera modules may be representative items photographing anobject in a still picture or a video. Recently, camera modulesperforming an auto focus function through a lens actuator have beenmanufactured. Meantime, the camera modules are disposed with a contactpin in order to electrically conduct the conventional lens actuator thusmentioned.

On the other hand, the camera modules having the contact pin suffer fromworkability when the contact pin is electrically connected and autofocus numbness (no auto focus) is generated due to contact inferiority(poor contact). Furthermore, there is a fear of destruction of cameramodule due to availability of contact pin when a camera module undergoesa shock test.

DETAILED DESCRIPTION OF THE INVENTION Technical Subject

In order to solve the abovementioned problems/disadvantages, exemplaryembodiments of the present invention provide a lens assembly performingan electric conductivity of optical module through an FPCB (FlexiblePrinted Circuit Board).

Furthermore, exemplary embodiments of the present invention provide acamera module performing an electric conductivity of optical modulethrough an active alignment by changing an optical adjustment between alens assembly and a base assembly to a full assembly type.

Moreover, exemplary embodiments of the present invention provide anoptical device including the camera module.

Technical Solution

In one general aspect of the present invention, there is provided a lensassembly comprising: a holder; a lens module disposed at an inner sideof the holder; an optical module disposed at an upper side of the lensmodule; and an conductive substrate electrically connected to theoptical module, wherein the conductive substrate includes: a body partdisposed at an upper side of the holder; and an extension part extendedfrom one end of the body part, and including a terminal part, and theholder includes a second lateral surface formed by being recessedinwards from a portion of a first lateral surface, and at least aportion of the extension part is disposed at the second lateral surface.

The second lateral surface may be extended from an upper end of theholder to a lower end of the holder in a shape corresponding to theextension part.

The terminal part may be formed at a lower end of the extension part,and a lower end of the terminal part may be disposed at more lower sidethan the lower end of the holder.

The lens assembly further comprises: a cover member disposed at an upperside of the holder, wherein the body part of the conductive substratemay be interposed between an upper side of the holder and a lower sideof the cover member, and wherein the cover member may include a firstreception groove in which a portion of the lower side is formed by beingrecessed in a corresponding shape to the portion of the body part of theconductive substrate and the extension part, and portions of the bodypart and the extension part are accommodated.

The optical module may be interposed between the body part of theconductive substrate and the cover member, wherein the cover member mayinclude a second reception groove in which a portion of the lower sideis formed by being recessed in a corresponding shape to the opticalmodule to accommodate the optical module, and the second receptiongroove forms a staircase with the first reception groove by being morerecessed than the first reception groove from the lower of the covermember.

The lens assembly may further comprise a shield member accommodating atan inside at least a portion of the holder, and the holder may furtherinclude a positioning end outwardly protruded from a first lateralsurface to be formed at a lower end of the holder and a lower end of theshield member is disposed at the positioning end.

An outer lateral surface of the extension part may be disposed at afarther inside than an outer lateral surface of the positioning end.

The outer lateral surface of the extension part may surface-contact aninner surface of a lateral plate of the shield member.

The terminal part may include a first terminal and a second terminal,each spaced apart from the other terminal, and the first and secondterminals may be disposed at a lower side of the shield member to beexposed to an outside.

Thickness of extension part may correspond to a depth of the secondlateral surface recessed from the first lateral surface.

The outer lateral surface of the extension part and the first lateralsurface of holder may be disposed on one same planar surface.

The second lateral surface may be extended from an upper end of theholder to a lower end of the holder.

The conductive substrate may include a through hole passing through aninside of the body part to an optical axis direction, and an electriccurrent carrying part protruded inwardly from an inner circumferentialsurface forming the through hole and electrically connected to theoptical module.

The lens module may be fixed to an inside of the holder, and the opticalmodule may perform any one or more of the auto focusing function and OISfunction in response to an applied power.

In another general aspect of the present invention, there is provided acamera module, comprising: a base assembly; and a lens assembly coupledto the base assembly, wherein the lens assembly includes: a holder; alens module disposed at an inner side of the holder; an optical moduledisposed at an upper side of the lens module; and an conductivesubstrate electrically connected to the optical module, wherein theconductive substrate includes: a body part disposed at an upper side ofthe holder; and an extension part extended from one end of the bodypart, and including a terminal part, and the holder includes a secondlateral surface formed by being recessed inwards from a portion of afirst lateral surface, and at least a portion of the extension part isdisposed at the second lateral surface.

The base assembly may include: a circuit substrate; an image sensormounted on the circuit substrate; a sensor base disposed on an uppersurface of the circuit substrate to accommodate the image sensor; and afilter disposed at a through hole of the sensor base.

The holder may include a first coupling surface coupled to the sensorbase, and the sensor base may include a second coupling surface facingthe first coupling surface of the holder, an area of the second couplingsurface may be larger than that of the first coupling surface, and thefirst coupling surface and the second coupling surface may be adhered byan adhesive member cured by more than any one of heat and UV(Ultraviolet) rays.

The sensor base may include a reception groove formed by being recessedinwardly from an outer circumferential surface, and at least a portionof terminal part may be accommodated into the reception groove, and theterminal part may be electrically connected to the circuit substratethrough an electric current carrying member.

The reception groove may be extended from a lower surface of the holder,and one surface may accommodate at least a portion of extension lugformed on the second lateral surface.

In still another general aspect of the present invention, there isprovided an optical device, comprising: a body part; a camera moduledisposed at the body part to photograph an image of a subject; and adisplay part disposed at the body part to output the image photographedby the camera module, wherein the camera module includes: a baseassembly; and a lens assembly coupled to the base assembly, wherein thelens assembly includes: a holder; a lens module disposed at an innerside of the holder; an optical module disposed at an upper side of thelens module; and an conductive substrate electrically connected to theoptical module, wherein the conductive substrate includes: a body partdisposed at an upper side of the holder; and an extension part extendedfrom one end of the body part, and including a terminal part, and theholder includes a second lateral surface formed by being recessedinwards from a portion of a first lateral surface, and at least aportion of the extension part is disposed at the second lateral surface.

A lens assembly according to an exemplary embodiment of the presentinvention may comprise: a holder; a lens module disposed at an innerside of the holder; an optical module disposed at an upper side of thelens module; and an conductive substrate electrically connected to theoptical module, wherein the conductive substrate includes: a body partdisposed at an upper side of the holder; and an extension part extendedfrom one end of the body part, and including a terminal part, and theholder includes a second lateral surface formed by being recessedinwards from a portion of a first lateral surface, and at least aportion of the extension part is disposed at the second lateral surface.

The extension part may be extended along the second lateral surface.

The lens assembly according to an exemplary embodiment of the presentinvention may further comprise: a cover member including a receptor partaccommodated by the optical module and disposed at an upper side of theholder; and a shield member accommodating, at an inside, at least aportion of the cover member and the holder, wherein the holder mayfurther include a positioning end outwardly protruded from the firstlateral surface to be disposed at a lower end of the holder, and a lowerend of the shield member may be coupled to the positioning end.

The terminal part may include a first terminal and a second terminal,each spaced apart from the other, and the first and second terminals maybe disposed at a lower side of the shield member to be exposed to anoutside.

The lower end of the terminal part may be disposed at a lower side lowerthan the lower end of the holder.

The conductive substrate may include a through hole passing through aninside of the body part to an optical axis direction, and an electriccurrent carrying part protruded from an inner circumferential surfaceforming the through hole to an inside to be electrically connected tothe optical module.

The lens module may be fixed to an inside of the holder, and the opticalmodule may perform any one or more of an auto focusing function and anOIS function in response to a power being applied.

A camera module according to an exemplary embodiment of the presentinvention may comprise: a base assembly; and a lens assembly coupled tothe base assembly, wherein the lens assembly includes: a holder; a lensmodule disposed at an inner side of the holder; an optical moduledisposed at an upper side of the lens module; and an conductivesubstrate electrically connected to the optical module, wherein theconductive substrate includes: a body part disposed at an upper side ofthe holder; and an extension part extended and bent from one end of thebody part, and the holder includes a second lateral surface formed bybeing recessed inwardly from a portion of a first lateral surface, andthe extension part includes a terminal part, and the terminal part isdisposed at the second lateral surface.

The base assembly may include: a circuit substrate; an image sensormounted on the circuit substrate; a sensor base disposed on an uppersurface of the circuit substrate to accommodate the image sensor; and afilter disposed at a through hole of the sensor base.

The holder may include a first coupling surface coupled to the sensorbase, and the sensor base may include a second coupling surface facingthe first coupling surface of the holder, an area of the second couplingsurface may be larger than that of the first coupling surface, and thefirst coupling surface and the second coupling surface may be adhered byan adhesive member cured by more than any one of heat and UV(Ultraviolet) rays.

The sensor base may include a reception groove formed by being recessedinwardly from an outer circumferential surface, and at least a portionof terminal part may be accommodated into the reception groove, and theterminal part may be electrically connected to the circuit substratethrough an electric current carrying member.

An optical device according to an exemplary embodiment of the presentinvention may comprise: a base assembly; and a lens assembly coupled tothe base assembly, wherein the lens assembly may further include aholder; a lens module disposed at an inner side of the holder; anoptical module disposed at an upper side of the lens module; and anconductive substrate electrically connected to the optical module,wherein the conductive substrate includes: a body part disposed at anupper side of the holder; and an extension part extended from one end ofthe body part, and including a terminal part, and the holder includes asecond lateral surface formed by being recessed inwards from a portionof a first lateral surface, and at least a portion of the extension partis disposed at the second lateral surface.

Advantageous Effects

An FPCB and an optical module can be bonded through SMT (Surface MounterTechnology) through the present exemplary embodiment to allow easyassembly between the FPCB and the optical module and to reduce the workhours.

The lens assembly is manufactured in an FPCB terminal type to allowsimplicity during soldering process.

An optimal lens performance can be realized through an active alignmentprocess.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view illustrating a camera module according toan exemplary embodiment of the present invention.

FIGS. 2 and 3 are exploded perspective view illustrating a camera moduleaccording to an exemplary embodiment of the present invention.

FIG. 4 is an exploded perspective view illustrating a lens assemblyaccording to an exemplary embodiment of the present invention.

FIG. 5 is an exploded perspective view illustrating a base assemblyaccording to an exemplary embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a camera module accordingto an exemplary embodiment of the present invention.

FIG. 7 is a perspective view illustrating an conductive substrate of acamera module according to a modification of the present invention.

BEST MODE

Some of the exemplary embodiments of the present invention will bedescribed with the accompanying drawings. Throughout the descriptions,the same reference numerals will be assigned to the same elements in theexplanations of the figures. Accordingly, in some embodiments,well-known processes, well-known device structures and well-knowntechniques are not illustrated in detail to avoid unclear interpretationof the present disclosure.

Furthermore, the terms “first,” “second,” “A”, “B”, (a), (b) and thelike, herein do not denote any order, quantity, or importance, butrather are used to distinguish one element from another. In thefollowing description and/or claims, the terms coupled and/or connected,along with their derivatives, may be used. In particular embodiments,connected may be used to indicate that two or more elements are indirect physical and/or electrical contact with each other. “Coupled” maymean that two or more elements are in direct physical and/or electricalcontact. However, coupled may also mean that two or more elements maynot be in direct contact with each other, but yet may still cooperateand/or interact with each other. For example, “coupled”, “joined” and“connected” may mean that two or more elements do not contact each otherbut are indirectly joined together via another element or intermediateelements.

An “optical axis direction” as used hereinafter may be defined as anoptical axis direction of a lens module in a state of being coupled to alens driving device. Meantime, the “optical axis direction” may beinterchangeably used with “vertical direction” and “z axis direction”and the like.

An “auto focus function” as used hereinafter may be defined as afunction of automatically matching a focus relative to an object byadjusting a distance from an image sensor by moving a lens module to anoptical axis direction. Meantime, the “auto focus” may beinterchangeably used with “AF”.

A “handshake correction function” as used hereinafter may be defined asa function of moving or tilting a lens module to a directionperpendicular to an optical axis direction in order to offset vibration(movement) generated on the image sensor by an outer force. Meantime,the “handshake correction” may be interchangeably used with an “OIS(Optical Image Stabilization)”.

Now, a configuration of an optical device according to an exemplaryembodiment of the present invention will be described hereinafter.

The optical device may be a hand phone, a mobile phone, a smart phone, aportable smart device, a digital camera, a notebook computer (laptopcomputer), a PMP (Portable Multimedia Player) and a navigation device.However, the present invention is not limited thereto, and may includeany device capable of photographing an image or a photograph.

The optical device may include a main body (not shown), a camera moduleand a display part (not shown). However, any one or more of the mainbody, the camera module and the display part may be omitted or changed.

The main body may form an exterior look of an optical device. Forexample, the main body may include a look of a cubic shape. For anotherexample, the main body may be formed in a round shape on at least someportions thereof. The main body may accommodate a camera module. Themain body may be arranged at one surface with a display part. Forexample, the display part and the camera module may be disposed at onesurface of the main body and a camera module may be additionallydisposed at the other surface (surface opposite to the one surface) ofmain body.

The camera module may be disposed at the main body. The camera modulemay be disposed at one surface of the main body. At least some portionsof the camera module may be accommodated into the main body. The cameramodule may be formed in a plural number. The plurality of camera modulesmay be respectively disposed at one surface of the main body and theother surface of the main body. The camera module may photograph animage of a subject.

The display portion may be disposed at the main body. The displayportion may be disposed at one surface of main body. That is, thedisplay portion may be arranged on a same surface as that of the cameramodule. Alternatively, the display portion may be disposed at the othersurface of main body. The display portion may be disposed at a surfaceon the main body opposite to a surface arranged with the camera module.The display portion may output an image photographed by the cameramodule.

Now, configuration of camera module according to an exemplary embodimentof the present invention will be described.

FIG. 1 is a perspective view illustrating a camera module according toan exemplary embodiment of the present invention, FIGS. 2 and 3 areexploded perspective view illustrating a camera module according to anexemplary embodiment of the present invention, FIG. 4 is an explodedperspective view illustrating a lens assembly according to an exemplaryembodiment of the present invention, FIG. 5 is an exploded perspectiveview illustrating a base assembly according to an exemplary embodimentof the present invention, FIG. 6 is a cross-sectional view illustratinga camera module according to an exemplary embodiment of the presentinvention, and FIG. 7 is a perspective view illustrating an conductivesubstrate of a camera module according to a modification of the presentinvention.

The camera module may include a lens assembly (100) and a base assembly(200). The lens assembly (100) may be coupled to the base assembly(200). The lens assembly (100) may be coupled to the base assembly (200)through active alignment process. That is, the lens assembly (100) maybe coupled to the base assembly (200) by the base assembly (200) by anadhesive member (not shown) that is cured by any one or more of heat andUV rays. The lens assembly (100) may be disposed at an upper side of thebase assembly (200).

The lens assembly (100) may include a holder (110), a lens module (120),an optical module (130), an conductive substrate (140), a cover member(150) and a shield member (160). However, any one or more of the holder(110), the lens module (120), the optical module (130), the conductivesubstrate (140), the cover member (150) and the shield member (160) maybe omitted or changed from the lens assembly (100).

The holder (110) may accommodate, at an inside, the lens module (120).The holder (110) may fixe the lens module (120) at the inside. An upperside of the holder (110) may be disposed with a body part (141) of theconductive substrate (140). The upper side of the holder (110) may bedisposed with the cover member (150). At least a portion of the holder(110) may be accommodated into an inside of the shield member (160). Theholder (110) may take a cubic shape having four (4) outercircumferential surfaces. The holder (110) may be formed with aninsulation body. However, the present invention is not limited thereto.

The holder (110) may include a reception groove (111) formed by beingrecessed at an outer side surface. The reception groove (111) may beformed at an outer side surface of the holder (110). The receptiongroove (111) may be formed at any one of four outer side surface of theholder (110) by being inwardly recessed. The reception groove (111) mayaccommodate at least a portion of the extension part (146) of theconductive substrate (140).

The holder (110) may include a first lateral surface (112) forming atleast a portion of any one of the outer side surface of holder (110).The holder (110) may include a second lateral surface (113) disposed bybeing inwardly recessed from the first lateral surface (112). The holder(110) may include a first lateral surface (112) disposed by outwardlybeing protruded from the second lateral surface (113). The extensionpart (146) of the conductive substrate (140) may be extended along thesecond lateral surface (113) of the holder (110). A lower end of theholder (110) may be disposed an upper side than a lower end of theterminal part (147, 148). The second lateral surface (113) may beextended to a lower end of the holder (110) from an upper end of theholder (110) in a shape corresponding to that of the extension part(146). The second lateral surface (113) may be extended from a lower endto an upper end of the holder (110) at a predetermined width. The secondlateral surface (113) may be formed at a center of a side surface at oneside of the holder (110).

The holder (110) may include a positioning end (114) disposed at a lowerpart by being outwardly protruded from the first lateral surface (112).The positioning end (114) may be outwardly protruded from the firstlateral surface (112). The positioning end (114) may be disposed at alower part of the holder (110). The positioning end (114) may becontacted by a lower end of the shield member (160). An outer sidesurface of positioning end (114) may be disposed at a more outer sidethan an outer side surface of the extension part (146). The outer sidesurface of positioning end (114) may be disposed on a same planarsurface as an outer surface of lateral plate of the shield member (160).The second lateral surface (113) of the holder (110) may not be formedwith the positioning end (114).

The holder (110) may include a coupling groove (115) coupled to acoupling lug (not shown) of the cover member (150). The coupling groove(150) may be formed at an upper side of the holder (110). The couplinggroove (150) may be formed by a portion of an upper surface of theholder (110) being downwardly recessed. The coupling groove (150) may becoupled to the coupling lug of the cover member (150). The couplinggroove (150) may take a shape corresponding to that of the coupling lugof the cover member (150). That is, the holder (110) and the covermember (150) may be securely coupled by coupling between the couplinggroove (150) of the holder (110) and the coupling lug of the covermember (150). However, as a modification, the holder (110) may be formedwith a coupling lug and the cover member (150) may be formed with acoupling groove.

The holder (110) may include a first coupling surface (116) coupled to abase (230). The first coupling surface (116) of holder (110) may becoupled to a second coupling surface (231) of base (230). At this time,an area of the first coupling surface (116) may be smaller than that ofthe second coupling surface (231). The first coupling surface (116) maymove on the second coupling surface (231) as much as a predeterminedinterval. In other words, the first coupling surface (116) and thesecond coupling surface (231) may be so formed as to allow the holder(110) and the base (230) to be coupled by an active alignment process.At this time, the first coupling surface (116) and the second couplingsurface (231) may be bonded by an adhesive member that may be hardenedby any one or more of heat and UV rays for active alignment.

The holder (110) may include an extension lug (117) protruded from alower surface to a lower side. The extension lug (117) may be downwardlyprotruded from the lower surface of holder (110). A lower end of theextension lug (117) may be disposed at a lower side than an uppersurface of the base (230). That is, at least one portion of theextension lug (117) may be overlapped with the base (230) to a directionperpendicular to an optical axis direction.

The lens module (120) may be disposed at an inside of the holder (110).The lens module (120) may be fixed to an inside of the holder (110). Thelens module (120) may be disposed at an upper side with the opticalmodule (130). The lens module (120) may include at least one lens (notshown). The lens module (120) may include a lens and a lens barrel. Thelens module (120) may include more than one lens and a lens barrelaccommodating more than one lens. However, one element of the lensmodule (120) is not limited to the lens barrel, and any holder structuresupportable one or more lenses may suffice. The lens module (120) may bescrew-connected to the holder (110), for example. The lens module (120)may be coupled to the holder (110) by an adhesive, for example.Meantime, a light having passed the lens module (120) may be irradiatedon the image sensor (220).

The optical module (130) may be disposed at an upper side of the lensmodule (120). The optical module (130) may be electrically connected tothe conductive substrate (140). The optical module (130) may beelectrically connected to an electric current carrying part (143) of theconductive substrate (140). The optical module (130) may be accommodatedinto a second reception groove (151 b) of the cover member (150). Theoptical module (130) may be provided with a wafer. The optical module(130) may be interposed between a body part (141) of the conductivesubstrate (140) and the cover member (150).

The optical module (130) may be formed with a cubic shape. The opticalmodule (130) may be formed with at least two electric current carryingpads (not shown). The optical module (130) may be formed with fourelectric current carrying pads, for example. However, the presentinvention is not limited thereto. The electric current carrying pad ofoptical module (130) may be electrically connected by the conductivesubstrate (140).

The optical module (130) may perform an auto focus function and/or OISfunction. That is, the optical module (130) may perform any one or moreof the auto focus function and/or the OIS function in response to powerbeing applied. Furthermore, the optical module (130) may be formed withan actuator of single lens moving type. Still furthermore, the opticalmodule (130) may perform an auto focus function and/or OIS function bychanging a refractive index of lens. The optical module (130) mayinclude an actuator having a variable lens formed by an LC (LiquidCrystal) lens, piezo polymer lens and the like. In this case, theoptical module (130) may perform an auto focus function and/or OISfunction by changing the refractive index of light passing through alens without physically moving the lens. The optical module (130) mayinclude any one or more of a MEMS (Micro Electro Mechanical System)actuator moving by using electrostatic power and piezo force, a MEMSpiezo actuator, a MEMS bimorph actuator, a MEMS thermal actuator, a MEMSmagnetic actuator, a MEMS liquid actuator, a non-MEMS type actuator, asilicon type actuator, and a liquid lens. However, the present inventionis not limited thereto.

The conductive substrate (140) may be electrically connected to theoptical module (130). The conductive substrate (140) may be electricallyconnected to the circuit substrate (210). The conductive substrate (140)may include an FPCB (Flexible Printed Circuit Board). That is, theconductive substrate (140) may have flexibility on at least a portionthereof. In this case, the body part (141) and the extension part (146)are integrally manufactured, where the extension part (146) may be bentto the body part (141).

The conductive substrate (140) may include a body part (141) disposed atan upper side of the holder (110). The body part (141) may be disposedat an upper side of the holder (110). The body part (141) may beelectrically conductive with the optical module (130). The body part(141) may be interposed between the holder (110) and the cover member(150). The body part (141) may be formed in a shape corresponding tothat of an upper surface of holder (110) and/or a lower surface of covermember (150). An inside of the body part (141) may be formed with athrough hole (142).

The conductive substrate (140) may include a through hole (142) passingthrough an inside of the body part (141) to an optical axis direction.The through hole (142) may pass through an inside of the body part (141)to an optical axis direction. The through hole (142) may be formed in ashape of a polygon including a square and a rectangle, a round and anellipse. However, the present invention is not limited thereto. A lighthaving passed the optical module (130) through the through hole (142)may be introduced into the lens module (120). The body part (141) may bedisposed between an upper surface of holder (110) and a lower surface ofcover member (150).

The conductive substrate (140) may include an electric current carryingpart (143) protruding inwardly from an inner circumferential surfaceforming the through hole (142) in the camera module according to themodification as illustrated in FIG. 7 . The conductive substrate (140)may include an electric current carrying part (143) electricallyconnected to the optical module (130). The electric current carryingpart (143) may be inwardly protruded from an inner circumferentialsurface forming the through hole (142). The electric current carryingpart (143) may be electrically connected to the optical module (130).The electric current carrying part (143) may be electrically connectedto the electric current carrying pad of the optical module (130). Forexample, the electric current carrying part (143) may include four (4)electric current carrying units coupled to the four (4) electric currentcarrying pads in a pair. At this time, the electric current carryingpart (143) and the electric current carrying pad of optical module (130)may be electrically conducted by an Ag Epoxy.

The conductive substrate (140) may include an extension part (146) bentand extended from one end of the body part (141). The extension part(146) may be bent and extended from one end of the body part (141).

The extension part (146) may be extended along the second lateralsurface (113) of the holder (110). The extension part (146) may contactthe second lateral surface (113) of the holder (110). The extension part(146) may be directly supported by the second lateral surface (113) ofthe holder (110). A portion of the extension part (146) may beaccommodated into a reception groove (111) of the holder (110). Aportion of the extension part (146) may be accommodated into a receptiongroove (230) of the base (230). A lower end of the extension part (146)may be disposed a lower side than a lower end of the holder (110). Alower end of the extension part (146) may be formed with terminal part(147, 148) electrically conductive to the circuit substrate (210).

The extension part (146) may be extended from an upper end of the holder(110) to a lower end along the second lateral surface (113). The outercircumferential surface of extension part (146) may be disposed at amore inner side than an outer circumferential surface of positioning end(114). The outer circumferential surface of extension part (146) maysurface-contact an inner surface of side (lateral) plate of the shieldmember (160). The thickness of extension part (146) may correspond to adepth of the second lateral surface (113) recessed from the firstlateral surface (112). The outer circumferential surface of extensionpart (146) and the first lateral surface (112) of holder (110) may bedisposed on a same planar surface.

The terminal part (147, 148) may be formed at a lower end of theextension part (146). Alternatively, the terminal part (147, 148) may beformed to be spaced apart from a lower end of the extension part (146)at a predetermined distance. The lower end of the terminal part (147,148) may be disposed at a more lower side than a lower end of the shieldmember (160). In this case, the lower end of the terminal part (147,148) may be exposed to an outside. The terminal part (147, 148) may beelectrically connected to the circuit substrate (210) through anelectric current carrying member (not shown). At this time, the electriccurrent carrying member may include a solder ball formed by thesoldering.

The terminal part (147, 148) may include a first terminal (147) and asecond terminal (148), each spaced apart from the other. The firstterminal (147) and the second terminal (148) may be spaced apart fromeach other to be disposed at a lower end of the extension part (146).The first terminal (147) and the second terminal (148) may beelectrically conducted with the circuit substrate (210). The firstterminal (147) and the second terminal (148) may be exposed to anoutside, and the externally-exposed first and second terminals (147,148) may be electrically conducted with the circuit substrate (210)through a soldering process.

The cover member (150) may be disposed at an upper side of the holder(110). The cover member (150) may be accommodated into an inside of theshield member (160). The cover member (150) may be disposed between anupper surface of the holder (110) and a lower surface of the upper plate(161) at the shield member (160). The thickness of cover member (150) toan optical axis direction may be thicker than a thickness of opticalmodule (130) to an optical axis direction.

The cover member (150) may include a first reception groove (151 a)formed by being recessed in a shape corresponding, at a portion of thelower surface thereof, to the body part (141) of the conductivesubstrate(140) and a portion of the extension part (146). The firstreception groove (151 a) may accommodate the body part (141) ofconductive substrate (140) and a portion of the extension part (146).The first reception groove (151 a) may form a staircase with a lowersurface of cover member (150). The first reception groove (151 a) mayform a staircase with a second reception groove (151 b).

The cover member (150) may include a second reception groove (151 b)formed by being recessed in a shape corresponding, at a portion of thelower surface, to the optical module (130). The second reception groove(151 b) may accommodate the optical module (130). The cover member (150)may include a second reception groove (151 b) accommodated by theoptical module (130). The second reception groove (151 b) may be formedby allowing a lower surface of the cover member (150) to be upwardlyrecessed. A width to perpendicular direction with the optical axisdirection of the second reception groove (151 b) may be greater than awidth to a perpendicular direction with the optical axis direction ofoptical module (130). That is, an outer circumferential surface ofoptical module (130) may be spaced apart from an inner circumferentialsurface forming the second reception groove (151 b) of cover member(150). The second reception groove (151 b) may form a staircase with thefirst reception groove (151 a) by being more recessed than the firstreception groove (151 a) from a lower surface of the cover member (150).

The cover member (150) may include a marking part (152) marked withdirectivity of cover member (150) for assembly. The cover member (150)may include a through hole (153) passing through an inside. A lighthaving passed through the through hole (153) may be incident on theoptical module (130). The cover member (150) may include a coupling lugcoupled to the coupling groove (115) of the holder (110). The couplinglug may be downwardly protruded from a lower surface of cover member(150).

The shield member (160) may accommodate, at an inside thereof, the covermember (150). The shield member (160) may accommodate, at an inside, atleast a portion of holder (110). The lower end of shield member (160)may contact the positioning end (114) of holder (110).

The shield member (160) may be formed with a metal material. The shieldmember (160) may be formed with a metal plate. In this case, the shieldmember (160) may shield an EMI (Electro Magnetic Interference). Due tothis feature of shield member (160), the shield member (160) may becalled an EMI shield can. The shield member (160) may cut off radio wavegenerated from outside of the shield member (160) from entering into aninside of the shield member (160). Furthermore, the shield member (160)may cut off the radio wave generated from inside of the shield member(160) from being emitted to an outside of the shield member (160).However, the material of shield member (160) is not limited thereto.

The shield member (160) may include an upper plate (161) and a lateral(side) plate (162). The shield member (160) may include an upper plate(161) and a lateral plate (162) bent downwardly from the upper plate(161). A lower end of lateral plate (162) at the shield member (160) maybe mounted on the positioning end (114) of holder (110). An innerlateral surface of shield member (160) may be mounted on the holder(110) by being tightly contacted to a portion or all of holder (110). Aninner space formed by the shield member (160) and the holder (110) maybe disposed with the holder (110), the lens module (120), the opticalmodule (130), the conductive substrate (140) and the cover member (150).Through this structure, the shield member (160) can protect innerconstitutional elements from outside impact. Furthermore, the shieldmember (160) may inhibit foreign pollutant materials from entering intoan inside. However, the shield member (160) may be directly coupled tothe base (230) disposed at a lower side of holder (110) or the circuitsubstrate (210).

The shield member (160) may include a through hole (163) passing throughan inside of the upper plate (161) to an optical axis direction. Theshield member (160) may include a through hole (163) formed at the upperplate (161) to expose the lens module. The through hole (163) may beformed in a shape corresponding to that of the lens module (120). Thesize of through hole (163) may be formed to be greater than a diameterof lens module (120) to allow the lens module (120) to be assembledthrough the through hole (163). Meantime, the light having passedthrough the through hole (163) may be introduced into the lens module(120). At this time, the light having passed the lens module (120) maybe obtained as an image by the image sensor (220).

The base assembly (200) may be coupled with the lens assembly (100). Thebase assembly (200) may be coupled with the lens assembly (100) throughactive alignment process. The base assembly (200) may be disposed at alower (lower) side of the lens assembly (100).

The base assembly (200) may include a circuit substrate (210), an imagesensor (220), a base (230), a filter (240) and a connector (250).However, any one or more of the circuit substrate (210), the imagesensor (220), the base (230), the filter (240) and the connector (250)may be omitted or changed from the base assembly (200).

The circuit substrate (210) may support the lens assembly (100). Thecircuit substrate (210) may be mounted with the image sensor (220). Anupper surface of circuit substrate (210) may be disposed with the base(230). An inner side of the upper surface at the circuit substrate (210)may be disposed with the image sensor (220), and an outside of the uppersurface at the circuit substrate (210) may be disposed with the base(230). An upper side of base (230) may be disposed with the lensassembly (100). Alternatively, an outside of upper surface at thecircuit substrate (210) may be disposed with the lens assembly (100),and an inside of the upper surface at the circuit substrate (210) may bedisposed with the image sensor (220). That is, the base (230) may beomitted and instead the holder (110) may be directly coupled with thecircuit substrate (210).

The circuit substrate (210) may supply an electric power to the lensassembly (100). The circuit substrate (210) may be electricallyconnected to terminal part (147, 148) of the conductive substrate (140)through the electric current carrying member. That is, the circuitsubstrate (210) and the conductive substrate (140) may be electricallyconducted. In this case, the circuit substrate (210) can supply theelectric power to the optical module (130) through the conductivesubstrate (140). The circuit substrate (210) may be disposed with acontroller for controlling the lens assembly (100).

The image sensor (220) may be mounted on the circuit substrate (210).The image sensor (220) may be accommodated into an inside of the base(230). The image sensor (220) may be so disposed as to match with thelens module (120) in terms of optical axis, through which the imagesensor (220) can obtain the light having passed the lens module (120).The image sensor (220) may output the obtained light as an image. Theimage sensor (220) may include any one or more of a CCD (charge coupleddevice), a MOS (metal oxide semi-conductor), a CPD and a CID. However,the present invention is not limited thereto.

The base (230) may be disposed at an upper surface of circuit substrate(210). The base (230) may accommodate, at an inside thereof, the imagesensor (220). The base (230) may support the holder (110). The base(230) may be coupled with the holder (110). The base (230) may becoupled with a first coupling surface (116) of holder (110). The base(230) may be coupled by the filter (240).

The base (230) may include a second coupling surface (231) coupled withthe first coupling surface (116) of holder (110). An area of secondcoupling surface (231) may be different from that of the first couplingsurface (116). The area of second coupling surface (231) may be greaterthan that of the first coupling surface (116). The second couplingsurface (231) may be overlapped with the first coupling surface (116) toan optical axis direction.

The base (230) may include a reception groove (232) formed by beinginwardly recessed from an outer circumferential surface. The receptiongroove (232) may be formed by being inwardly recessed from an outercircumferential surface of base (230). The reception groove (232) mayaccommodate a portion of the extension part (146) of the conductivesubstrate (140). the reception groove (232) may accommodate at least aportion of the extension lug (117) of holder (110). The reception groove(232) may be extended from a lower surface of holder (110), and onesurface of reception groove (232) may accommodate at least a portion ofthe extension lug (117) formed to the second lateral surface (113).

The base (230) may include a through hole (233) passing through aninside to an optical axis direction. The through hole (233) may bedisposed with the filter (240). The light having passed the through hole(233) may be introduced into the image sensor (220).

The base (230) may include a lug part (234) protruding from an uppersurface to an upper side and coupled, at an inside, by the filter (240).The lug part (234) may be protruded from an upper surface of base (230)to an upper side. An inside of the lug part (234) may be coupled by thefilter (240). The lug part (234) may be spaced apart from an innercircumferential surface of holder (110). In this case, an allowancespace can be obtained for active alignment of holder (110).

The filter (240) may be disposed at the through hole (233) of base(230). Alternatively, the filter (220) may be disposed at a holdermember (not shown) which is separately formed apart from the base (230).The filter (240) may cut off a light of infrared region from beingincident on the image sensor (220). The filter (240) may include aninfrared absorption filter (Blue filter). The filter (240) may includean infrared reflection filter (IR cut filter). The filter (240) may beinterposed between the lens module (120) and the image sensor (220). Thefilter (240) may be formed with a film material or a glass material. Thefilter (240) may be formed by coating an infrared cut-off coatingmaterial on a plate-type optical filter such as an imaging surfaceprotection cover glass or a cover glass. However, the present inventionis not limited thereto.

The connector (250) may be electrically connected to the circuitsubstrate (210). The connector (250) may be electrically connected to anexternal element of camera module. That is, the connector (250) may beused to electrically connect the external element of camera module tothe camera module.

The camera module according to an exemplary embodiment of the presentinvention may further comprise a controller (not shown). The controllermay be mounted on the circuit substrate (210). The controller may bedisposed at an outside of the lens assembly (100). However, thecontroller may be also disposed at an inside of the lens assembly (100).The controller may control the direction of current supplied to theoptical module (130) at the lens assembly (100), intensity andamplitude. The controller may control the optical module (130) toperform any one or more of the auto focus function and OIS function ofthe camera module.

Hereinafter, an assembly process of camera module according to anexemplary embodiment of the present invention will be described.

First, the assembly process of lens assembly (100) will be explained.

A first coupling body coupled with the lens module (120) on the holder(110) is prepared. The optical module (130) and the conductive substrate(140) are electrically connected through an Ag Epoxy. At this time, thecoupling by the Ag epoxy may be replaced by any conductive couplingmethod including a coupling by a soldering. Then, the optical module(130) is covered with the cover member (150), which is an initial moldproduct, in order to protect from an external pressure. In other words,the cover member (150) may be manufactured through molding process. Thecover member (150) thus manufactured may be so coupled as to accommodatethe optical module (130). Thereafter, a second coupling body is preparedby covering the cover member (150) with the shield member (160). Theprepared second coupling body is coupled to the first coupling body tocomplete the assembly of optical lens assembly (100). At this time, theextension part (146) of conductive substrate (140) is made to contactthe second lateral surface (113) of holder (110). However, the assemblyof lens assembly (100) may be also finished in such a manner that thecover member (150) coupled with the optical module (130) is coupled tothe first coupling body, on which the shield member (160) is thencovered.

Now, the assembly process of base assembly (200) will be explained.

The circuit substrate (210) coupled with the connector (250) isprepared. Then, the image sensor (220) is mounted on an upper surface ofcircuit substrate (210). Thereafter, the base (230) coupled with thefilter (240) is fixed on an upper surface of circuit substrate (210) inorder to accommodate the image sensor (220) at an inside to therebycomplete the assembly of base assembly (200).

Thereafter, the lens assembly (100) is mounted on the base assembly(200) through the active alignment process. To be more specific, anepoxy curable by heat or ultraviolet rays is coated on the secondcoupling surface (231) of the base (230). The first coupling surface(116) of holder (110) is arranged on the epoxy. Subsequently, analignment between an optical axis of lens module (120) and an opticalaxis of image sensor (220) is adjusted. When an alignment of opticalaxis between the lens module (120) and the image sensor (220) isadjusted, epoxy is hardened using ultraviolet rays. Thereafter, theepoxy is hardened in earnest in the oven to fix the lens assembly (100)to the base assembly (200). Meantime, the pair of terminals (147, 148)of the conductive substrate (140) and the circuit substrate (210) areelectrically connected using the soldering process to complete themanufacturing of camera module according to an exemplary embodiment ofpresent invention.

Although the present disclosure has been explained with all constituentelements forming the exemplary embodiments of the present disclosurebeing combined in one embodiment, or being operated in one embodiment,the present disclosure is not limited thereto. That is, in some cases,the described features, structures, or operations may be combined in anysuitable manner in one or more embodiments. It will also be readilyunderstood that the components of the embodiments, as generallydescribed and illustrated in the figures herein, could be arranged anddesigned in a wide variety of different configurations.

In the term “includes”, “including”, “comprises” and/or “comprising” asused herein, the mentioned component, step, operation and/or device isnot excluded from presence or addition of one or more other components,steps, operations and/or devices.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by one ofordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims.

Although the abovementioned embodiments according to the presentinvention have been described in detail with reference to the abovespecific examples, the embodiments are, however, intended to beillustrative only, and thereby do not limit the scope of protection ofthe present invention. Thereby, it should be appreciated by the skilledin the art that changes, modifications and amendments to the aboveexamples may be made without deviating from the scope of protection ofthe invention.

1. A camera module comprising: a PCB (Printed Circuit Board); an imagesensor disposed on the PCB; a holder disposed on the PCB; a lens coupledwith the holder; an actuator disposed on the lens; a substrateelectrically connecting the actuator and the PCB; and a shield membercovering at least a portion of the holder, wherein the holder comprisesa positioning end outwardly protruding from a lateral surface of theholder, and wherein the shield member is disposed on the positioningend.
 2. The camera module of claim 1, comprising an optical moduleconfigured to perform at least one of an auto focus function and anoptical image stabilization function, and wherein the optical modulecomprises the actuator.
 3. The camera module of claim 1, comprising acover member disposed on the holder, wherein the substrate comprises abody part disposed between the holder and the cover member, wherein theactuator is disposed between the body part of the substrate and thecover member, wherein the cover member comprises a first groovecomprising a shape corresponding to a body part of the substrate anddisposed with the body part of the substrate and a second groovecomprising a shape corresponding to the actuator and disposed with theactuator, and wherein the second groove forms a staircase with the firstgroove by being more recessed than the first groove.
 4. The cameramodule of claim 1, comprising a base disposed between the PCB and theholder, wherein the base comprises a receptor groove concavely formed ona lateral surface of the base, and wherein the substrate comprises afirs terminal disposed on the receptor groove of the base and coupledwith the PCB.
 5. The camera module of claim 4, comprising a filterdisposed on the base.
 6. The camera module of claim 1, wherein thesubstrate comprises a hole and a second terminal protruding inwardlyfrom an inner peripheral surface of the hole of the substrate, andwherein the second terminal is coupled with the actuator.
 7. The cameramodule of claim 3, wherein the holder comprises a groove formed on thelateral surface of the holder, wherein the substrate comprises anextension part disposed on the groove of the holder, and wherein thegroove of the holder comprises a shape corresponding to the extensionpart.
 8. The camera module of claim 7, wherein the extension part isintegrally formed with the body part.
 9. The camera module of claim 3,wherein the holder comprises a hole, wherein the lens is disposed on thehole of the holder, wherein the body part of the substrate is disposedon a perimeter of the hole of the holder, and wherein the body part ofthe substrate comprises a hole disposed between the lens and theactuator.
 10. The camera module of claim 4, wherein a lower end of thefirst terminal is disposed lower than a lower end of the holder.
 11. Thecamera module of claim 4, wherein the first terminal is disposed lowerthan a lower end of the shield member to be exposed to an outside. 12.The camera module of claim 7, wherein the shield member comprises anupper plate and a lateral plate extending from the upper plate, andwherein the extension part contacts the lateral plate of the shieldmember.
 13. The camera module of claim 1, wherein the actuator comprisesa liquid lens.
 14. The camera module of claim 4, wherein the receptorgroove of the base accommodates an extension lug extending from a lowersurface of the holder.
 15. An optical device, comprising: a body; thecamera module of claim 1 disposed on the body to photograph an image ofa subject; and a display disposed on the body to output the imagephotographed by the camera module.
 16. A camera module comprising: a PCB(Printed Circuit Board); an image sensor disposed on the PCB; a basedisposed on the PCB; a holder disposed on the base; a lens coupled withthe holder; an actuator coupled with the lens; a substrate electricallyconnected with the actuator; and a shield member disposed on the holder,wherein the holder comprises a positioning end outwardly protruding froma lateral surface of the holder, and wherein the shield member isdisposed on the positioning end.
 17. The camera module of claim 16,comprising an optical module configured to perform at least one of anauto focus function and an optical image stabilization function, andwherein the optical module comprises the actuator.
 18. The camera moduleof claim 16, comprising a cover member disposed on the holder, whereinthe substrate comprises a body part disposed between the holder and thecover member, wherein the actuator is disposed between the body part ofthe substrate and the cover member, wherein the cover member comprises afirst groove comprising a shape corresponding to a body part of thesubstrate and disposed with the body part of the substrate and a secondgroove comprising a shape corresponding to the actuator and disposedwith the actuator, and wherein the second groove forms a staircase withthe first groove by being more recessed than the first groove.
 19. Thecamera module of claim 16, wherein the base comprises a receptor grooveconcavely formed on a lateral surface of the base, and wherein thesubstrate comprises a firs terminal disposed on the receptor groove ofthe base and coupled with the PCB.
 20. A camera module comprising: a PCB(Printed Circuit Board); an image sensor disposed on the PCB; a holderdisposed on the PCB; and a lens coupled with the holder.